forum 'be-flexible', december 2 and 3

20. - 21. November 2013 in Munich

This international platform is intended for scientists, applied researchers, equipment suppliers and users. An excellent opportunity to exchange ideas and experiences in the world of thin semiconductor devices and flexible electronics.

Learn about the latest activities and developments, about materials, processing & equipment, applications and market perspectives. Discuss present and future challenges in this exciting and fast evolving area with leading companies and suppliers.

like every autumn, this workshop is organised by the department Polytronic Systems of Fraunhofer EMFT, in Munich, Germany

 

motto 2013

systems integration
killer applications
best practice
roadmapping ?
no go’s
lessons learned

mott

 

the forum be-flexible consists of two consecutive days with invited speakers for special foci.
the workshop day on thin semiconductor devices discusses technologies and approaches for wafer thinning and handling of thin and ultra-thin wafers, processing of thin wafers and dicing concepts. It brings up applications such as chip cards and power devices and deals with the potential of the system integration of thin chips such as usage in portable electronic equipment, or enhancing performance of components. One topic handles the cost-efficient (self-)assembly on flexible substrates for very flat packages such as 3D-integrated chip stacks (MEMS, CSP), opto-electronic devices (LED, solar cells) and ultra-thin RFID applications.

the workshop day on flexible electronic systems focuses on thin and flexible, highly functional electronic systems, commonly known as ‘smart systems’, ‘smart textiles’ and ‘ubiquitous applications’. The combination of functional organic and polymer materials and flexible substrates opens a broad perspective towards low-cost and large volume manufacturing. This workshop day brings up functionality and processing of flexible and polymeric materials, machinery, the integration of additional optical functions and components such as sensors or data transfer and possible applications for smart objects


We are looking forward to meeting you at the Forum be-flexible 2013 at Fraunhofer EMFT in Munich   
Prof. Dr. Karlheinz Bock, head of department Polytronic Systems

updates

Forum be-flexible 2013

coming soon: call for papers

 

 

IEEE - 2013 ISCDG
26./27.September, Dresden

call for papers is on:
www.iscdg.org

 

 

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