forum 'be-flexible', december 2 and 3

19. - 20. November 2014 in Munich

This international platform with two consecutive days is intended for scientists, applied researchers, equipment suppliers and users. An excellent opportunity to exchange ideas and experiences in the world of thin semiconductor devices and flexible electronics.

organised by Fraunhofer EMFT, Munich, Germany

labonchip tastatur
co2foil sichip


the workshop day thin semiconductor devices discusses technologies and approaches for wafer thinning and handling of thin and ultra-thin wafers, processing of thin wafers, dicing concepts and self-assembly concepts as well as the integration in flexible electronic systems for a multitude of applications

the workshop day flexible electronic systems focuses on system integration and processing of thin and flexible, highly functional smart systems, smart textiles and ubiquitous applications. It also introduces new materials and novel and enhanced functionalities, such as sensors, and advances in material and machinery.

featuring the keynote speakers
Dr. Octavio Trovarelli, Director of Process Engineering, , Plastic Logic, Dresden, Germany
Wolf Richter, EPIC Semiconductors, Vancouver, Canada

We look forward to meeting you again at the next Forum be-flexible in 2014 at Fraunhofer EMFT in Munich   
Prof. Christoph Kutter, Director Fraunhofer EMFT


Forum be-flexible 2014

19 - 20. November 2014,
Fraunhofer EMFT, Munich

Dear Guest,
Thank you very much for your visit. The download of the workshop proceedings is available now.





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