the annual, international workshop late autumn was initiated by the department Polytronic Systems, in Munich, to face present and future challenges concerning research, technology, integration, manufacturing and trends of thin semiconductors and the fast evolving world of flexible electronics.
This international platform is intended for an exchange of experiences of scientists, applied researchers, equipment suppliers and users. Learn about the latest developments, materials & processing & equipments, applications and market perspectives and get in touch with the leading companies and suppliers.

motto 2010:
systems integration – key to application – best practice – roadmapping ? – no go’s – possible applications

the forum be-flexible is designed of two consecutive days with invited speakers for special foci.
the workshop day thin semiconductor devices discusses technologies and approaches for wafer thinning and handling of thin and ultra-thin wafer, processing of thin wafer and dicing concepts. It brings up applications such as for chip cards and power devices and deals with the prospects for the system integration of thin chips such as portable electronic equipment, enhanced performance of components and cost-efficient (self-)assembly on flexible substrates for very flat packages such as 3D-integrated chip stacks (MEMS, CSP), opto-electronic devices (LED, solar cells) and ultra-thin RFID applications.

flexible electronic systems discusses thin and flexible, highly functional electronic systems, commonly known as ‘smart systems’, ‘smart textiles’ and ‘ubiquitous applications’. The combination of functional organic and polymer materials and flexible substrates opens a broad perspective towards low-cost and large volume manufacturing. This workshop day brings up functionality and processing of flexible and polymeric materials, machinery, the integration of additional optical functions and components such as sensors or data transfer and possible applications for smart objects

on the subsequemt day of the workshop, december 3, we would like to invite you to an Open Lab Day at our facilities for more detailed presentations from our experts, discussions with fellow attendees and to tour our labs

We are looking forward to welcome you to the forum be-flexible 2010 in Munich'   - Prof. Dr. Karlheinz Bock, acting director Fraunhofer IZM Munich and head of department Polytronic Systems