November 17 and 18, 2015 - PROGRAM IS ONLINE - REGISTER NOW
THIN SEMICONDUCTOR DEVICES and FLEXIBLE ELECTRONIC SYSTEMS for the INTERNET OF THINGS
This international platform discusses applications and developments of THIN SEMICONDUCTOR DEVICES and FLEXIBLE ELECTRONIC SYSTEMS since the year 2000, addressing scientists, applied researchers, materials and equipment suppliers, users and visionaries.
You will find an application-oriented program featuring invited presentations, combining forces of thin semiconductor devices and flexible electronic systems for a wide field of applications and the present and upcoming challenges for the Internet of Things
lifestyle – wearables – consumables – health – robotics – thin silicon – printing and assembly technologies – flexible electronic systems – visions & markets – sensors – security...
This will be an excellent opportunity for an exchange of ideas and experiences in the fast evolving world of thin semiconductor devices and flexible electronics. Find new ideas in the combinations - network with other companies - enhance your potential field of customers - participate in the panel discussion with renowned scientists and visionaries and discuss selected exhibition items
We look forward to welcoming you to the FORUM BE-FLEXIBLE 2015 at Fraunhofer EMFT in Munich
Prof. Christoph Kutter, Director Fraunhofer EMFT
speaker: Professor Takao Someya - Professor Dr. Gordon Cheng - Dr. Michael Alexander - Dr. Maximilian Müller - Petra Weiler - Jean-Christophe Eloy - Prof. Dr. Reinhard R. Baumann - Dan Negrea - Prof. Dr. Joachim Burghartz - Professor Paolo Lugli - Thomas Suwald - Dr. Wolfgang Bochtler - Carsten Wesselkamp - Dr. Octavio Trovarelli - Maximillian Bee - Roland Guillemain - Claude Labro - John Whitmarsh - Fiona O'Brien - Gerald Klug - Christof Landesberger
from: University of Tokyo, Japan - Technische Universitaet Muenchen, Cognitive Systems, Munich, Germany - Roland Berger Strategy Consultants GmbH, Munich, Germany - Moticon GmbH, Munich, Germany - EPoSS e.V., VDI/VDE Innovation + Technik GmbH, Berlin, Germany - Yole Developpement, Lyon, France - TU Chemnitz, Digital Printing and Imaging Technology, Chemnitz, Germany - AEMtec GmbH, member of exceet, Berlin, Germany - IMS Chips, Stuttgart, Germany - Institute for Nanoelectronics, Technische Universitaet Muenchen, Germany - NXP Semiconductors, Hamburg, Germany - Nippon Mektron Ltd., Japan (Mektec Group), Weinheim, Germany - Plan Optik AG, Elsoff, Germany - Plastic Logic Germany, Dresden, Germany - Reinhardt Microtech GmbH, Cicor Group, Ulm, Germany - LINXENS Group, Mantes-la-Jolie, France - Afelim, Saint-Cloud, France - ESL Europe, Reading, England - Adhesives Research Ireland ltd., Limerick, Ireland - DISCO HI-TEC EUROPE GmbH, Kirchheim b. Munich, Germany - Fraunhofer EMFT, Munich, Germany
workshop Panel Processing - Filling the Gap between Frontend and PCB
a cooperation of TechSearch International, Inc., U.S.A., and Fraunhofer EMFT
as every other year we are glad to announce again a workshop in cooperation with TechSearch International, Inc., U.S.A. the day before PRODUCTRONICA
location: at the facilities of Fraunhofer EMFT, Munich
find here directions to Fraunhofer EMFT and a suggestion of hotels
Creating a TSensors-Based Abundant Future
Join us for the 2015 TSensors Summit, the seventh to be held worldwide. We have lined up a remarkable group of speakers; participating organizations are from the technical and financial industries, academia and government.