thin semiconductor devices
11th international workshop on december 1, 2010, venue hotel LeMeridien in Munich
motto
system integration - key to application - best practice - road mapping ? - no go's - possible applications
thin semiconductor components have been prevalent for a number of years in microelectronics. Important segments in today’s microelectronics market are integrated circuits on chip cards as well as power devices. A further reduction in chip thickness results in even more distinct advantages, such as in very flat packages for portable electronic equipment, enhanced performance of components and cost efficient assembly on flexible substrates.
Current trends in the development of technologies for very thin semiconductors are targeting on 3D-integrated chip stacks (MEMS, CSP), opto-electronic devices (LED, solar cells) and ultra-thin RFID applications. The purpose of this workshop is to provide an insight into latest developments of technologies, materials, processes and applications.
| thin semiconductor devices |  |
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| wafer thinning and handling | |||
| thin wafer processing | |||
| thin devices - applications | |||
| flexible systems - applications | |||
| keynote presenter | |||
| again this year we have invited keynote presenter - check for details later | |||
| presentations on december 1, 2010 |
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| DISCO Hi-Tec Europe - Midoriko Honda - Kirchheim b. Munich, Germany Updates on ultra thin wafer processing |
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| EV Group - Dr. Josef Meiler - Florian a. Inn, Austria Low Temperature Bonding with Thin Wafers for 3D Integration |
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| ISIS sentronics - Dr. Alexander Knuettel - Mannheim, Germany Non-contact roughness and 3D topography evaluation of grinded wafers down to nm level |
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| Fraunhofer EMFT - Christof Landesberger, Prof. Karlheinz Bock - Munich, Germany Proving the robustness of thin silicon |
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| Institut für Mikroelektronik Stuttgart (IMS CHIPS) - Dr. Christine Harendt - Stuttgart, Germany Mechanical Stability of Ultra-thin Chips down to 6 µm |
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| MC10 - Dr. Jeff Carbeck, David Icke - Cambridge, MA, U.S.A. High-Performance, Conformal Electronics |
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| NXP Semiconductors - Guido Albermann - Hamburg, Germany LASER dicing - A cost effcient IC separation tecnology |
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| Okamoto Machine Tool Europe - Thomas Loscher - Langen, Germany TSV Process - Solution for ultra thin wafers |
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| SUSS MicroTec Lithography - Markus Gabriel, Volkan Cetin - Garching, Germany Equipment challenges and solutions for bonding and debo |
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| to be confirmed | |
| to be confirmed |
| access to the workshop proceedings will be emailed to all attendees shortly after the workshop |
| evening reception | subsequent to the presentations, more... |
| fees and registration | more... |
| summary of deadlines | more... |
| registration | more... |