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thin semiconductor devices

13^th international workshop on november 21, 2012
venue Fraunhofer EMFT in Munich, Germany

motto
systems integration - killer applications - best practice - roadmapping ? - no go's - lessons learned

thin semiconductor components have been prevalent for a number of years in microelectronics. Important segments in today’s microelectronics market are integrated circuits on chip cards as well as power devices.
A further reduction in chip thickness results in even more distinct advantages, such as in very flat packages for portable electronic equipment, enhanced performance of components and cost efficient assembly on flexible substrates.
Current trends in the development of technologies for very thin semiconductors are targeting on 3D-integrated chip stacks (MEMS, CSP), opto-electronic devices (LED, solar cells) and ultra-thin RFID applications. This workshop provides an insight into latest developments of technologies, materials, processes and applications.

sessions: wafer thinning and handling thin wafer processing thin devices applications flexible systems - applications

speaker from ASE (Europe), Centre for Research in Adaptive Nanostructures and Nanodevices, DISCO Hi-Tec Europe, ESO, EV Group, Fraunhofer CSP und EMFT, IMS Chips, Lambda Technologies Inc., Moticon, NXP Semiconductors Germany, Panasonic Factory Solutions Europe, Rockwood Wafer Reclaim, Suss MicroTec Lithography, etc follow this link for the workshop proceedings (attendees only !)