forum 'be-flexible', december 2 and 3

thin semiconductor devices

15th international workshop on november 19, 2014
venue Fraunhofer EMFT in Munich, Germany


systems integration - killer applications - best practice - roadmapping ? - no go's - lessons learned

thin semiconductor components have been prevalent for a number of years in microelectronics. Important segments in today’s microelectronics market are e.g. integrated circuits on chip cards and power devices.
A further reduction in chip thickness results in even more distinct advantages, such as in very flat packages for portable electronic equipment, enhanced performance of components and cost efficient assembly on flexible substrates.
Current trends in the development of technologies for very thin semiconductors are targeting on 3D-integrated chip stacks (MEMS, CSP), opto-electronic devices (LED, solar cells) and ultra-thin RFID applications. This workshop provides an insight into latest developments of technologies, materials, processes and applications.

sessions on:

wafer thinning and handling
thin wafer processing
thin devices applications
flexible systems - applications

thin si on foil






call for papers is on,
submit your abstract by September 07, 2014, here


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