about the workshop thin semiconductor devices flexible electronic systems open lab day fees & registration    evening reception venue & accomodation call for papers / speakers' info contact past workshop's proceedingsFraunhofer EMFT   

 

thin semiconductor devices

12^th international workshop on november 23, 2011
venue hotel LeMeridien in Munich

motto
system integration - key to application - best practice - road mapping ? - no go's - possible applications

thin semiconductor components have been prevalent for a number of years in microelectronics. Important segments in today’s microelectronics market are integrated circuits on chip cards as well as power devices.
A further reduction in chip thickness results in even more distinct advantages, such as in very flat packages for portable electronic equipment, enhanced performance of components and cost efficient assembly on flexible substrates.
Current trends in the development of technologies for very thin semiconductors are targeting on 3D-integrated chip stacks (MEMS, CSP), opto-electronic devices (LED, solar cells) and ultra-thin RFID applications. The purpose of this workshop is to provide an insight into latest developments of technologies, materials, processes and applications.

thin semiconductor devices wafer thinning and handling thin wafer processing thin devices applications flexible systems - applications   keynotes from Sony Deutschland and Infineon

presentations from Bio-MEMS, DISCO HI-TEC EUROPE, EV Group, Institute for Medical Science & Technology, ISIS sentronics, Logitech, Robert Bosch, SUSS MicroTec Lithography, Yole Developpement and Fraunhofer EMFT see agenda here:
evening reception	subsequent, at about 18:00, more...
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