forum 'be-flexible', december 2 and 3

thin semiconductor devices

12th international workshop on november 23, 2011
venue hotel LeMeridien in Munich

motto
system integration - key to application - best practice - road mapping ? - no go's - possible applications

thin semiconductor components have been prevalent for a number of years in microelectronics. Important segments in today’s microelectronics market are integrated circuits on chip cards as well as power devices.
A further reduction in chip thickness results in even more distinct advantages, such as in very flat packages for portable electronic equipment, enhanced performance of components and cost efficient assembly on flexible substrates.
Current trends in the development of technologies for very thin semiconductors are targeting on 3D-integrated chip stacks (MEMS, CSP), opto-electronic devices (LED, solar cells) and ultra-thin RFID applications. The purpose of this workshop is to provide an insight into latest developments of technologies, materials, processes and applications.

thin semiconductor devices

wafer thinning and handling
thin wafer processing thin devices applications
flexible systems - applications

 

keynotes from
Sony Deutschland and Infineon

 

flexsistahlband

 

 

 

 

 

 

presentations from Bio-MEMS, DISCO HI-TEC EUROPE, EV Group, Institute for Medical Science & Technology,
ISIS sentronics, Logitech, Robert Bosch, SUSS MicroTec Lithography, Yole Developpement and Fraunhofer EMFT
see agenda here:

evening reception subsequent, at about 18:00, more...
fees and registration  more...
summary of deadlines more...

 

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