forum 'be-flexible', december 2 and 3

thin semiconductor devices

15th international workshop on november 19, 2014
venue Fraunhofer EMFT in Munich, Germany


systems integration - killer applications - best practice - roadmapping ? - no go's - lessons learned

thin semiconductor components have been prevalent for a number of years in microelectronics. Important segments in today’s microelectronics market are e.g. integrated circuits on chip cards and power devices.
A further reduction in chip thickness results in even more distinct advantages, such as in very flat packages for portable electronic equipment, enhanced performance of components and cost efficient assembly on flexible substrates.
Current trends in the development of technologies for very thin semiconductors are targeting on 3D-integrated chip stacks (MEMS, CSP), opto-electronic devices (LED, solar cells) and ultra-thin RFID applications. This workshop provides an insight into latest developments of technologies, materials, processes and applications.

key topics:

wafer thinning and handling
thin wafer processing
thin devices applications
flexible systems - applications

thin si on foil





featuring the invited talk from Gerhard Zeller, TDK / EPCOS, Munich, Germany
agenda November 19, 2014 find here the download of the proceedings (password required)
Invited Talk
SESUB, Embedding of thinned Dies in Laminate
Gerhard Zeller, Director FAE, EPCOS AG, A TDK Group Company ,
Munich, Germany
Dicing and Grinding for SiC and Sapphire, TAIKO process
Christoph Epple, DISCO HI-TEC EUROPE GmbH, Kirchheim b. Muenchen, Germany
Plasma Dicing 4 Thin Wafer
Reinhard Windemuth, Panasonic Factory Solutions Europe, Muenchen, Germany
Challenges for Automation of 300mm Thin Wafer Handling
Dr. Germar Schneider, Infineon Technologies Dresden GmbH, Germany
Debonding Processes for Thin Wafer Handling
Margarete Zoberbier, SUSS MicroTec Lithography GmbH, Garching, Germany
Stress free Wafer mounting for MEMS and thin wafers with reduction of tape consumption
Gerald P. Wiltsche, Euris GmbH, Munich, Germany
Next generation of contactless wafer shipping
Holger Walther, Entegris GmbH, Dresden, Germany
LED-on-foil: technologies and applications
Dr. Ashok Sridhar, Holst Centre, Eindhoven, The Netherlands
Further thin die flip chip bonding story of LED
Tetsuya Onishi, Grand Joint Technology Ltd., Hongkong
Versatile Stacking Process for Monolithic Integration
Dr. Thomas Uhrmann, EV Group (EVG), St. Florian am Inn, Austria
Development of bare die embedded substrate
Prof. Katsumi Miyama, Hokkaido University of Science, Sapporo, Japan
Tailored patterning materials for thin & flexible systems
Dr. Anja Voigt, micro resist technology GmbH, Berlin, Germany
Printing versus coating technology for solution coating
Andrea Glawe, KROENERT GmbH & Co GmbH; Hamburg, Germany
From ultra-thin silicon to flexible chip foil packages
Christof Landesberger, Fraunhofer EMFT, Munich, Germany
Evening Reception subsequent, beginning at about 18:00


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